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integrated 500 ma load switch with quad signal switch data sheet ADP1190 rev. 0 document feedback information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications sub ject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062 - 9106, u.s.a. tel: 781.329.4700 ? 2013 analog devices, inc. all rights reserved. technical support www.analog.com features low input voltage range : 1. 4 v to 3.6 v power switch: l ow rds on of 60 m at 3.6 v , with a ctive d ischarge 4 normally open spst s ignal s witch es : rds on of 2 at 1.8 v with active pull - down on one side 500 ma continuous operating current built - i n level shift for control logic that can be operated by 1. 2 v logic ultra low shutdown current : < 0.7 a u ltra small 1.2 mm 1.6 mm 0. 5 mm, 12 - ball , 0.4 mm pitch wlcsp applications mobile phones sim c ard d isconnect switch es digital camera s and audio devices portable and battery - powered equipment functional block d iagram figure 1 . general description the ADP1190 is a n integrated high - side load switch with four signal switches , designed for operation from 1. 4 v to 3.6 v . thi s load switch provide s power domain isolation for extended power battery life . the load switch is a low on - resistance p- channel mosfet that supports up to 500 ma of continuous load current and minimizes power loss . integr ated with the load switch are four normally open 2 ? spst signal switches. aside from its excellent operating performance , the ADP1190 occup ies minimal printed circuit board ( pcb ) space with an area less than 1.92 mm 2 and a height of 0. 5 0 mm. the ADP1190 is available in an ultra small 1.2 mm 1.6 mm , 12 - ball, 0.4 mm pitch w l c s p. 4m? t1 s1 p n t2 s2 p n t3 s3 p n t4 gnd out s4 p n en 5ms debounce in off on load switch 1 1259-001
ADP1190 data sheet rev. 0 | page 2 of 12 table of contents features .............................................................................................. 1 applications ....................................................................................... 1 functional block diagram .............................................................. 1 general description ......................................................................... 1 revision history ............................................................................... 2 specifications ..................................................................................... 3 timing diagram ........................................................................... 3 absolute maxim um ratings ............................................................ 4 thermal data ................................................................................ 4 thermal resistance .......................................................................4 esd caution ...................................................................................4 pin configuration and function descriptions ..............................5 typical performance characteristics ..............................................6 theory of operation .........................................................................9 application block diagram ........................................................... 10 outline dimensions ....................................................................... 11 ordering g uide .......................................................................... 11 revision history 4/13 revision 0: initial version
data sheet ADP1190 rev. 0 | page 3 of 12 specifications v in = 1.8 v , v en = v in , i load = 2 0 0 ma, t a = 25 c, unless otherwise noted. table 1. parameter symbol test conditions /comments min typ max unit input voltage range v in t j = ?40c to + 8 5c 1.4 3.6 v en input en input threshold v en_th 1.4 v < v in < 1.8 v, t j = ? 40c to +85c ( active l ow) 0.35 1.2 v 1.8 v v in 3.6 v, t j = ? 40c to +85c ( a ctive l ow) 0.45 1.2 v logic high voltage v ih 1.4 v v in 3.6 v 1.2 v logic low voltage v il 1.4 v v in 3.6 v ( c hip e nable) 0.35 v en input pull - up resistance r en 4 m current ground current 1 i gnd out open, t j = ?40c to +85c 2 a shutdown current i off en = v in or open 0.7 a en = v in or open , t j = ?40c to +85c 2 a analog switch off current i a_off into s1 , en = v in or open 0.4 a load switch v in to v out resistance rds on v in = 3.6 v, i load = 200 ma, en = 1.5 v 60 m v in = 2.5 v, i load = 200 ma, en = 1.5 v 80 m v in = 1.8 v, i load = 200 ma, en = 1.5 v, t j = ?40c to +85c 100 170 m signal switch resistance rds on maximum value of analog input sweep v in = 3.6 v, i load = 10 ma, en = gnd 0.6 v in = 2.5 v, i load = 10 ma, en = gnd 1 v in = 1.8 v, i load = 10 ma, en = gnd 2.0 rds flatness v in = 3.6 v, i load = 10 ma, en = gnd 0.5 v in = 1.8 v, i load = 10 ma, en = gnd 1 output discharge resistance r dis on load switch output and each analog switch output, t1, t2, t3, and t4 215 ?3 db bandwidth bw 3db v in = 3.6 v, r l oad = 50 , c load = 5 pf, see figure 23 50 mhz v out time turn - on delay time t on_dly i load = 200 ma, en = gnd, c load = 0. 1 f 5 ms turn - off delay time t off_dly v in = 3.6 v, i load = 200 ma, en = 1.5 v, c load = 0.1 f 4 s 1 ground current includes en pull - down current. timing diagram figure 2 . timing diagram 90% 10% turn-off delay turn-on delay turn-off time turn-on time 1 1259-004
ADP1190 data sheet rev. 0 | page 4 of 12 absolute maximum rat ings table 2. parameter rating in to gnd ?0.3 v to +4.0 v out to gnd ?0.3 v to v in sx to gnd ?0.3 v to +4.0 v t x to gnd ?0.3 v to +4.0 v en to gnd ?0.3 v to +4.0 v continuous load switch current t a = 25c 1 a t a = 85c 500 ma continuous diode current ?50 ma storage temperature range ?65c to +150c junction temperature +150c operating junction temperature range ?40c to +125c operating ambient temperature range ?40c to +85c soldering conditions jedec j - std -020 stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. thermal data absolute maximum ratings apply individually only, not in combination. the ADP1190 can be damaged when the junction temperature limits are exceeded. monitoring ambient tempera - ture does not guarantee that t j is within the specified temperature limits. in applications with high power dissipation and poor thermal resistance, the maximum ambient temperature may need to be derated. in applications with moderate power dissipation and low pcb thermal resistance, the maximum ambient tempe rature can exceed the maximum limit as long as the junction temperature is within specification limits. the junction temperature (t j ) of the device is dependent on the ambient temperature (t a ), the power dissipation of the device (p d ), and the junction - to - ambient thermal resistance of the package ( ja ). maximum junction temperature (t j ) is calculated from the ambient temperature (t a ) and power dissipation (p d ) using the formula t j = t a + (p d ja ) the j unction - to - ambient thermal resistance ( ja ) of the package is based on modeling and calculation using a 4 - layer board. the junction - to - ambient thermal resistance is highly dependent on the application and board layout. in applications where high maxi - mum power dissipation exists, close attention to thermal board design is required. the value of ja may vary, depending on pcb material, layout, and environmental conditions. the speci - fied value of ja is based on a 4 - layer, 4 in. 3 in. circuit board. see jesd51 - 7 and jesd51 - 9 for detailed information on the board construction. for additional information, see the an - 617 application note , wafer level chip scale package , available at www.analog.com . jb is the junction - to - board thermal characterization parameter with units of c/w. jb of the package is based on modeling and calculation using a 4 - layer board. jesd51 - 12, guidelines for reporting and using electronic package thermal information , states tha t thermal characterization parameters are not the same as thermal resistances. jb measures the component power flowing through multiple thermal paths rather than through a single path as in thermal resistance, jb . therefore, jb thermal paths include con vection from the top of the package as well as radiation from the package, factors that make jb more useful in real - world applications. maximum junction temperature (t j ) is calculated from the board temperature (t b ) and power dissipation (p d ) using the fo rmula t j = t b + (p d jb ) see jesd51 - 8 and jesd51 - 12 for more detailed information about jb . thermal resistance ja and jb are specified for the worst - case conditions, that is, a device soldered in a circuit board for surface - mount packages. table 3 . thermal resistance package type ja jb unit 12- ball wlcsp 130 29.2 c/w esd caution
data sheet ADP1190 rev. 0 | page 5 of 12 pin configuration an d function descripti ons figure 3 . pin configuration table 4 . pin function descriptions pin no. mnemonic description a1 gnd ground. b1 en enable input , active low . c1 in input voltage. d1 out load switch output voltage. a2 t1 channel 1 analog switch. connect to the sim card socket (has active discharge). b2 t2 channel 2 analog switch. connect to the sim card socket (has active discharge). c2 t3 channel 3 analog switch. connect to the sim card socket (has active discharge). d2 t4 channel 4 analog switch. connect to the sim card socket (has active discharge). a3 s1 channel 1 analog switch. connect to the microcontroller. b 3 s2 channel 2 analog switch. connect to the microcontroller. c3 s3 channel 3 analog switch. connect to the microcontroller. d 3 s4 channel 4 analog switch. connect to the microcontroller. top view (ball side down) not to scale ADP1190 gnd t1 s1 en t2 s2 in t3 s3 out t4 s4 1 a b c d 2 3 1 1259-002
ADP1190 data sheet rev. 0 | page 6 of 12 typical performance characteristics v in = 1.8 v, v en = v in , c in = c out = 1 f, t a = 25c, unless otherwise noted. figure 4 . load switch rds on vs. input voltage (v in ), different load currents figure 5 . load switch rds on vs. temperature, different load currents , v in = 1.8 v figure 6 . load switch rds on vs. temperature, different load currents , v in = 3.6 v figure 7 . load switch voltage drop vs. load current , different input voltages figure 8 . ground current vs. input voltage , different load currents figure 9 . ground current vs. temperature, different load currents, v in = 1.8 v 1.2 3.6 3.2 2.8 2.4 2.0 1.6 rds on () v in (v) 0 0.02 0.04 0.06 0.08 0.10 0.12 0.14 5ma 10ma 50ma 100ma 250ma 500ma 1 1259-005 ?40 ?5 25 55 85 rds on () temperature (c) 0 0.02 0.04 0.06 0.08 0.10 0.12 10ma 50ma 100ma 250ma 500ma 1 1259-006 ?40 ?5 25 55 85 rds on () temperature (c) 0 0.02 0.04 0.06 0.08 0.09 0.01 0.03 0.05 0.07 10ma 50ma 100ma 250ma 500ma 1 1259-007 10 100 1000 voltage drop (v) i load (ma) 0 0.02 0.04 0.06 0.07 0.01 0.03 0.05 1.4v 1.5v 1.6v 1.8v 2.0v 2.4v 2.8v 3.0v 3.3v 3.6v 11259-008 1.2 2.4 3.6 2.0 3.2 1.6 2.8 ground current (a) v in (v) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 5ma 10ma 50ma 100ma 250ma 500ma 1 1259-009 ?40 ?5 25 55 85 ground current (a) temperature (c) 0 0.2 0.1 0.3 0.4 0.5 0.6 0.7 10ma 50ma 100ma 250ma 500ma 1 1259-010
data sheet ADP1190 rev. 0 | page 7 of 12 figure 10 . ground current vs. temperature, different load currents, v in = 3.6 v figure 11 . shutdown curren t vs. temperatur e , different input voltages figure 12 . no load ground current vs. input voltage and temperature figure 13 . signal switch rds on vs. analog switch voltage figure 14 . signal switch rds on vs. analog switch voltage and temperature, v in = 1.4 v figure 15 . signal switch rds on vs. analog switch voltage and temperature, v in = 1.8 v ?40 ?5 25 55 85 ground current (a) temperature (c) 0 0.2 0.4 0.6 0.8 1.0 1.2 10ma 50ma 100ma 250ma 500ma 1 1259-0 1 1 ?50 ?30 ?10 10 30 50 70 90 shutdown current (a) temperature (c) 0 0.1 0.2 0.3 0.4 0.5 0.6 1.4v 1.6v 1.8v 2.4v 2.8v 3.3v 3.6v 1 1259-012 1.2 1.6 2.0 2.4 2.8 3.2 3.6 ground current (a) v in (v) 0 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 +25c ?5c ?40c +55c +85c 1 1259-013 0 3.6 3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 rds on () analog switch voltage (v) 0 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 3.6v 2.2v 1.8v 1.6v 1.4v 11259-014 0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 rds on () analog switch voltage (v) 0 10 9 8 7 6 5 4 3 2 1 +25c ?5c ?40c +55c +85c 1 1259-015 0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 rds on () analog switch voltage (v) 0 3.0 2.5 2.0 1.5 1.0 0.5 +25c ?5c ?40c +55c +85c 1 1259-016
ADP1190 data sheet rev. 0 | page 8 of 12 figure 16 . signal switch rds on vs. analog switch voltage and temperature, v in = 3.6 v figure 17 . typical turn - on delay time, v in = 1 .8 v, 50 m a load figure 18 . typical turn - on delay time, v in = 3.6 v, 100 ma load figure 19 . enable debounce behavior, v in = 1.8 v figure 20 . enable debounce behavior, v in = 3.6 v 0 3.6 3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 rds on () analog switch voltage (v) 0 3.0 2.5 2.0 1.5 1.0 0.5 +25c ?5c ?40c +55c +85c 1 1259-017 ch1 2.0v b w ch3 1.0v b w ch2 1.0v b w m1.0ms a ch1 880mv t 10.80% 1 2 3 t enable t1 v out 1 1259-018 ch1 2.0v b w ch3 2.0v b w ch2 2.0v b w m1.0ms a ch2 1.08v t 65.40% 1 2 3 t enable t1 v out 1 1259-019 ch1 1.0v b w ch3 2.0v b w m2.0ms a ch1 40.0mv t 10.40% 1 3 t enable v out 1 1259-020 ch1 1.0v b w ch3 2.0v b w m2.0ms a ch1 1.08v t 10.00% 1 3 t enable v out 1 1259-021
data sheet ADP1190 rev. 0 | page 9 of 12 theory of operation the ADP1190 is a high-side load switch integrated with four signal switches. the load switch and signal switches are turned on by a low signal on the en pin. a 4 m pull-up resistor on this pin allows it to be driven by an open-collector or mechani- cal switch. when the part is disabled, the t1 to t4 pins are actively pulled down with a nominal resistance of 215 . there is a 5 ms debounce counter on en for use with a mechanical en switch. that is, en must be held low for 5 ms before the part is enabled. if en transitions high before this timeout, the counter is reset and starts a new 5 ms count. the signal path is controlled by a pmos/nmos transmission gate with an on resistance of 2 . break-before-make logic control ensures that the active pull-down is off before the signal path is enabled. in addition to these features, the ADP1190 occupies minimal printed circuit board (pcb) space with an area less than 1.92 mm 2 and a height of 0.50 mm. the ADP1190 is available in an ultrasmall 1.2 mm 1.6 mm, 12-ball, 0.4 mm pitch wlcsp. figure 21. block diagram with esd protection devices 11259-023 4m ? t1 s1 p n t2 s2 p n t3 s3 p n t4 gnd out s4 p n en 5ms debounce in off on
ADP1190 data sheet rev. 0 | page 10 of 12 a pplication b lock d iagram figure 22 . typical application figure 23 . bandwidth measurement setup 4m? t1 s1 p n t2 s2 p n t3 s3 p n t4 s4 p n micro- controller sim card gnd out i/o i/o rst clk gnd v cc en in v in = 1.4v to 3.6v connector 11259-003 50? 50? p n v out v s network analyzer 1 1259-022
data sheet ADP1190 rev. 0 | page 11 of 12 outline dimensions figure 24 . 12 - ball wafer level chip scale package [wlcsp] (cb - 12- 10) dimensions shown in millimeters ordering guide model 1 temperature range package description package option branding ADP1190acbz - r7 ?40c to +85c 12- ball wafer level chip scale package [wlcsp] cb -12-10 lne 1 z = rohs compliant part . a b c d 0.560 0.500 0.440 1.24 1.20 1.16 1.64 1.60 1.56 1 2 3 bot t om view (bal l side up) t o p view (bal l side down) end view 0.300 0.260 0.220 1.20 ref 0.80 ref 0.40 bsc bal l a1 identifier 02-22-2013- a se a ting plane 0.230 0.200 0.170 0.330 0.300 0.270 coplanarity 0.04
ADP1190 data sheet rev. 0 | page 12 of 12 notes ? 2013 analog devices, inc. all rights reserved. trademarks and registered trademarks are the property of their respective owners. d11259 - 0 - 4/13(0)

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